JPS623585B2 - - Google Patents
Info
- Publication number
- JPS623585B2 JPS623585B2 JP5677278A JP5677278A JPS623585B2 JP S623585 B2 JPS623585 B2 JP S623585B2 JP 5677278 A JP5677278 A JP 5677278A JP 5677278 A JP5677278 A JP 5677278A JP S623585 B2 JPS623585 B2 JP S623585B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- base
- resin
- ribbon
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5677278A JPS54148379A (en) | 1978-05-12 | 1978-05-12 | Plating method of base ribbon for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5677278A JPS54148379A (en) | 1978-05-12 | 1978-05-12 | Plating method of base ribbon for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54148379A JPS54148379A (en) | 1979-11-20 |
| JPS623585B2 true JPS623585B2 (en]) | 1987-01-26 |
Family
ID=13036757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5677278A Granted JPS54148379A (en) | 1978-05-12 | 1978-05-12 | Plating method of base ribbon for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54148379A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108563A (ja) * | 1985-11-06 | 1987-05-19 | Mitsubishi Electric Corp | めつき処理装置 |
| US5512780A (en) * | 1994-09-09 | 1996-04-30 | Sun Microsystems, Inc. | Inorganic chip-to-package interconnection circuit |
-
1978
- 1978-05-12 JP JP5677278A patent/JPS54148379A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54148379A (en) | 1979-11-20 |
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